Wisconsin Institute of Packaging Professionals (IOPP) Chapter Scholarship
University of Wisconsin, Stout - College of Tech., Engineering and Mgm
amount
Varies
awards available
Unspecified
deadline
February 03, 2025 Add to Calendar
Description
The Wisconsin Institute of Packaging Professionals (IOPP) Chapter Scholarship is available to sophomore packaging majors at the University of Wisconsin-Stout. You must be a resident of Wisconsin and have a minimum GPA of 3.0 to qualify for this award.
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