Branahl 20th Anniversary Endowed Engineering Scholarship
University of Missouri, St. Louis
amount
$2,213
awards available
Unspecified
deadline
April 11, 2025 Add to Calendar
Description
The Branahl 20th Anniversary Endowed Engineering Scholarship is available to undergraduate students enrolled in the University of Missouri-St. Louis/Washington University joint engineering program. You must have a minimum 2.5 GPA to be eligible for this award.
You Might Also Like
Ready to apply?
Visit the provider's website to get more information and apply:
