Tighe and Bond Scholarship
Out in Science, Technology, Engineering, and Mathematics (oSTEM), Inc.
amount
$2,500
awards available
1
deadline
May 18, 2025 Add to Calendar
Description
The Tighe and Bond Scholarship is available to undergraduate and graduate students. You must identify as a member of the LGBTQ+ community, be a registered oSTEM member (free), be a U.S. citizen/permanent resident, reside in the Northeastern part of the U.S., and have a minimum GPA of 3.0 to be considered for this award. Additionally, you should be majoring in one of the following disciplines: Civil Engineering, Environmental Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Environmental Science, Natural Resource Management, Wildlife & Fisheries, Geology/ Mining, Structural Engineering, Transportation Engineering, GIS, Urban Planning, Landscape Architecture, Architectural Engineering, Environmental and Sustainability Studies, Earth Science, Environmental Management & Sciences, Plant Science/ Horticulture, or Soil Science
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